In 2023, Wistron's Chengdu site achieved the highest level of UL2799 Zero Waste to Landfill certification, attaining a waste conversion rate of 99.69%. This accomplishment not only highlights our efforts in environmental protection and sustainable development but also represents a firm commitment to social responsibility.
The core of the UL2799 Zero Waste to Landfill certification is to ensure that waste generated during the manufacturing process is properly managed to avoid landfilling, thereby reducing the negative impact on the environment. Landfilling waste can cause long-term pollution to land and groundwater resources, and it may pose serious threats to ecosystems and human health. Therefore, the zero waste to landfill certification encourages companies to seek more environmentally friendly disposal methods, such as recycling, reusing, and resource recovery, to achieve waste reduction and resource utilization.
West China
Wistron's Chengdu Site Achieves Highest Platinum Level Certification for Zero Waste to Landfill—A Firm Step Toward a Greener Future
SDGs
In this process, Wistron's Chengdu site has adopted a series of innovative measures to maximize the waste conversion rate. Not only has it invested in advanced recycling technologies, but it has also continuously optimized production processes to reduce waste generation. Additionally, it actively participates in recycling and reuse projects, transforming waste into valuable resources, thereby creating dual value for the company and society.
The significance of the certification lies not only in reducing the demand for natural resources but also in promoting resource recycling, lowering energy and water consumption. For resource conservation and enhancing resource utilization efficiency, the zero waste to landfill certification has profound implications. At the same time, it is a solemn commitment to social responsibility, capable of enhancing the company's social image and strengthening its credibility and reputation in the field of sustainable development.
